Naming

  • Sark, originally a non-sense word, is simply ‘Shark’ without an ‘h’ and it has been used as my English name since my adolescence.
  • P. – the initial of Pangrui (庞锐), my first name in Mandarin, is less introduced to my western friends as it is too confronting for them to pronounce.
  • Xing, my surname (邢), is pronounced as similar as ‘Sing’.

Education

  • 🎓 The Hong Kong Polytechnic University, Hong Kong SAR

  • 🎓 Eindhoven University of Technology, the Netherlands

    • M.Sc. 2018 – 2020, Industrial Design, specializing in Interaction Design.
    • Coach: Dr. Yaliang Chuang.

  • 🎓 Beijing Normal University Zhuhai, China

    • B.Eng. 2014 – 2018, Industrial Design, specializing in Product Design. Top 1% Excellent Graduate; overall score 88/100.
    • ‘14 – ‘18 Portfolio

Journal

  • Wei, L.†, Xing, S.P.†, Chow, K.K.N. and Wang, S.J., (2026). Grounding Pedagogical Intents in Embodied AI Teachers: A Human-Centered Framework for Designing and Evaluating Instructional Gestures, Int. J. Hum.–Comput. Interact. DOI. †Co-first authors. (CCF-B, IF=6.1, JCR Q1)
  • Ma, Z., Fang, L., Fang, C., Chen, F., Xing, S.P., Chai, B., Zheng, Z. and Wang, S.J., (2025). Intelligent Wearable System Design for Personalized Knee Motion and Swelling Monitoring in Osteoarthritis Care, Cell Rep. Phys. Sci. 6(3), 102438. DOI. (IF=7.3, JCR Q1)
  • Fang, L., Xing, S.P., Ma, Z., Zhang, Z., Long, Y., Lee, K.P. and Wang, S.J., (2024). Emo-MG Framework: LSTM-based Multi-modal Emotion Detection through Electroencephalography Signals and Micro Gestures, Int. J. Hum.–Comput. Interact. 40(18), 5056–5072. DOI. (SCI, CS Q1, CCF-B, IF=4.92)
  • Fang, L., Xing, S.P., Long, Y., Lee, K.P. and Wang, S.J., (2023). EmoSense: Revealing True Emotions Through Microgestures, Adv. Intell. Syst. 2300050. DOI. (SCI, CS Q1, IF=7.4)

Conference

  • Xing, S.P., Hu, H., Wei, L., Fang, L., Bai, Z., Jiang, S. and Wang, S.J., (2026). CapSenseBand: Sustaining Cross-disciplinary Creativity when Stitches Must Meet Signals, In Proceedings of the 2026 ACM Conference on Creativity and Cognition, 1547–1555. DOI.
  • Xing, S.P., Van Dijk, B., An, P., Bruns, M., Chuang, Y. and Wang, S.J., (2023). Puffy: A Step-by-step Guide to Craft Bio-inspired Artifacts with Interactive Materiality, In Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction, (TEI ’23). Association for Computing Machinery, New York, NY, USA. DOI. (CORE A)

Academic & Community Services

  • Reviewer, 2023 – 2027
    • ACM Conference on Computer Supported Cooperative Work (CSCW), 2023 and 2025
    • ACM Conference on Designing Interactive Systems (DIS), 2023: Paper & PWiP
    • ACM International Conference on Tangible, Embedded, and Embodied Interaction (TEI), 2024 and 2027
    • International Conference on Human-Computer Interaction (HCII), 2023: Paper
  • Google Scholar: 59 citations, h-index 4, i10-index 3, snapshot 28 September 2026.

Talks & Workshops

  • Xing, S.P., Fang, L. and Wang, S.J., (2022). EmoSense Band: Capacitive-sensing Wristband that Detects Microgestures for Stress Recognition. Outstanding Study Award, International Conference on Intelligent Wearable Systems (ICIWS 2022)
  • Xing, S.P. and Chuang, Y. (2021). ESPBoost: A Rapid Prototyping Toolkit for Helping Designers Create the Internet of Tangible Things, In Proceedings of the 2021 Workshops on Computer Human Interaction in IoT Applications. CHIIoT 2021. PDF

Selected Projects

  • CapSenseBand, 2022 – 2026, Interaction designer & prototyping engineer, PolyU. Textile 3D structures with swept-frequency capacitive sensing. The industry application case was presented internally and published at ACM C&C 2026.
  • Puffy, 2019 – 2023, Designer & lead prototyper, TU Eindhoven / PolyU. An interactive artifact whose form changes. The Research through Design process is the ACM TEI 2023 pictorial.
  • PermeaSense, 2023 – present, Design researcher & prototyping engineer, PolyU. A modular toolkit for permeable, customisable electronics worn on the skin: custom PCB, flexible circuits, wireless charging and small-batch fabrication. Electronic units have run; material and interaction development continues.
  • SyncKnee / Transparent Knee Guard, 2024 – present, Lead technical designer & prototype engineer, PolyU. Early technical exploration, custom boards and BLE acquisition for a university-funded project. Published in Cell Reports Physical Science (2025), with a CN/HK patent family. Later commercialisation sits with Mirror Caring Limited.
  • EmoSense to EmoFriends, 2021 – present, Hardware & prototype contributor, PolyU. Sensing hardware and microgesture prototypes for a university-funded project, two journal papers, and the EmoSense patent family as third inventor. The technology was later used by EmoFriends.
  • ESPBoost, 2020 – 2021, Designer & developer, TU Eindhoven. An open-source ESP32 shield for connected tangible products: connectivity, I/O and power.

Patents

  • Wang, S.J., Ma, Z., Fang, L., Chen, F., Fang, C., Xing, S.P. and Zheng, Z. Knee joint monitoring method, system, and wearable device. China patent publication CN120713506A, 30 September 2025; Hong Kong patent publication HK40126428A, 24 December 2025.
  • Wang, S.J., Fang, L. and Xing, S.P. Psychological stress level detection method, apparatus, and system (EmoSense family). China patent publication CN116343998A, 27 June 2023; Hong Kong short-term patent HK30085572, 4 August 2023; PCT publication WO2024222418A1, 31 October 2024. Third inventor.
  • Xing, P., Yang, Z., Xiong, W. and Huang, H. 2017. 折纸遥控玩具 [Origami remote-control toy]. CN206404327U / ZL201621434017.9, filed 26 December 2016, granted 15 August 2017.
  • Xing, P., Yang, Z., Xiong, W. and Huang, H. 2017. 玩具遥控驱动器 [Toy remote-control driver]. ZL201630571980.0, filed 24 November 2016, granted 20 June 2017.

Recognition

  • Silver Medal, 50th International Exhibition of Inventions Geneva, 2025. EmoFriends / EmoSense invention lineage; third inventor of EmoSense.
  • Top Performer, PolyU Micro Fund Scheme, 2024 – 2025. Transparent Knee.
  • Research Postgraduate Scholarship, The Hong Kong Polytechnic University, 2021 – 2024.
  • 2018 Excellent Graduate 优秀毕业生, Top 1%, Industrial Design, BNUZ. Overall score 88/100.
  • Silver Award 银奖, 2016 DiD Award / Dongguan Cup International Industrial Design Competition. 小乖 (Pikapika); main designer.
  • National Excellence Award, 2016 China Universities Industrial Design Competition. 月食 (Eclipse).

Exhibition

  • 2019 Dutch Technology Week, Eindhoven, NL
  • 8th Guangdong Industrial Design Expo, Dec ‘16
  • 2nd Biennale of The Academy Awards | The Guangdong College Design Works, Dec ‘16

Teaching Assistant

  • SD5514, Advanced Visualization and Interaction, School of Design, The Hong Kong Polytechnic University, Spring 2023. Two sessions for different master’s cohorts, drawing on my TEI work, plus support for interaction design projects.
  • SD5969, Transformative Technologies, School of Design, The Hong Kong Polytechnic University, Fall 2021. Technical tutorials and example code for design inquiry and prototyping.
  • Official Design Research Studio, BNUZ, 2016 – 2017. Student lab lead for a 17-person peer team: studio work, prototyping, and competition preparation.

Professional Experiences

  • Intel-NTU IoX Center, Taipei, Research Intern, July – August ‘19. Focused, peripheral and implicit interaction.
  • Cumulus Dafen Maker Workshop, Shenzhen, Selected Candidate, Summer ‘15

Interests

Expertise

  • Languages: Mandarin (native), Hokkien / Teochew (native), English (C1), Cantonese (fluent).
  • Research & design: Research through Design, scoping reviews, material experimentation, qualitative and quantitative evaluation, industrial and interaction design, CMF, design for manufacturing.
  • User evaluation: Wizard of Oz, field study, semi-structured interview, thematic analysis.
  • Electronics: EDA, MCU selection and firmware flashing, custom wireless charging, flexible circuits, small-batch PCB fabrication. ESP32, ESP8266, nRF52, Arduino, I²C, SPI, UART, BLE and Wi-Fi.
  • Prototyping: Foam, laser cutting, 3D printing, liquid-metal/PDMS, porous electrospun SBS. Sketching and experience-able mock-ups.
  • Software: SolidWorks, KeyShot, Adobe Photoshop, Illustrator, InDesign and Lightroom. Arduino (C/C++), Go, Python, HTML/CSS, JavaScript. OOCSI, self-hosted, MongoDB Atlas, Firebase Realtime Database. AI-assisted coding is reviewed and tested before it lands in a prototype.
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